1、 Core physical performance

1. Lightweight and high-strength

The density is only 4.51g/cm ³, and the tensile strength of TC4 titanium foil reaches 930-1130MPa, ranking first among industrial metals in terms of specific strength. It is suitable for weight reducing components such as wing skins and missile shells.

Ultra thin specification: capable of rolling 0.01mm, with a controllable weight per unit area of 0.5g/m ².

2. Extreme temperature adaptability

High temperature performance: Long term working strength ≥ 450MPa at 500 ℃, with a thermal expansion coefficient similar to that of steel;

Low temperature performance: Elongation rate ≥ 15% in liquid nitrogen environment at -196 ℃, used for supporting structures of superconducting equipment.

2、 Chemical and Environmental Stability

Corrosion resistance: Passivation film can resist seawater/strong acids, with a lifespan of over 30 years. It is suitable for seawater desalination condenser tubes and chemical reactor liners;

Biocompatibility: Cytotoxicity level 0, excellent blood compatibility for cardiac stents and orthopedic repair membranes;

Electromagnetic inertness: Magnetic permeability ≈ 1.00004, completely non-magnetic, shielding layer for nuclear magnetic resonance equipment, satellite precision sensors;

3、 Special functional attributes

1. Acoustic conduction optimization

Elastic modulus of 110GPa, low high-frequency vibration transmission loss, used for speaker diaphragm.

2. Thermal management characteristics

Thermal conductivity of 15-20 W/(m · K), steam droplet condensation design improves heat transfer efficiency, and the lifespan of chemical heat exchangers increases by 50%.

4、 Breakthrough in cutting-edge applications

Aerospace thermal protection: The return capsule of the Alliance spacecraft adopts a 0.3mm titanium foil honeycomb substrate to resist the frictional heat of re-entry at 3000 ℃, and the temperature difference inside the capsule is less than 7 ℃;

3D printing: Laser cladding TC4ELI titanium foil customized skull repair mesh, with precise porosity control of 90 ± 5%;

Microelectronics packaging: Ultra thin titanium foil is used as the electromagnetic shielding layer of the chip, attenuating 99.9% of the emitted electron interference.